About the Program
The Humanoid Robotics Winter Camp is an immersive, two-week learning experience designed to introduce high school students and university undergraduates to the fascinating world of humanoid robotics.
Through guided workshops, expert mentorship, and real-world challenges, participants will learn to assemble, program, and interact with humanoid robots using the award-winning Printable Intelligent Bot (PIB) platform, an open-source robotics initiative that democratises access to cutting-edge technology.
The camp combines technical skill-building with creativity and collaboration, allowing participants to explore robotics, AI, and design in a fun and inspiring environment.
Dates
15 – 26 December
Location
3D Printed Office – Emirates Towers
Who Can Apply
15 high-school students (ages 14–17)
15 undergraduate students (ages 18–20)
What We’re
Aiming For?
Aiming For?
- Assembling and programing humanoid robots
- Teaching real-time interaction (voice, gesture, behaviour scripting)
- Encouraging teamwork and interdisciplinary collaboration
- Promoting creativity in robotics problem-solving
What Makes
This Different?
This Different?
- Bridging the gap between robotics education and real-world deployment
- Empowering learners to explore, prototype, and implement robotics solutions
- Fostering practical, hands-on experience in STEM fields
- Enhancing creativity, technical skills, and collaborative abilities
Who Are We
Looking For?
Looking For?
- High school students (ages 14–17 ) interested in technology, engineering, or AI
- University undergraduates (ages 18–20) studying or aspiring towards STEM-related fields
- Creative thinkers who enjoy problem-solving, teamwork, and hands-on experimentation
WHY PIB?
PIB is an award-winning, open-source robotics initiative democratising access to humanoid robotics through practical learning experiences. They empower learners to build, program, and experiment with 3D-printable robots, significantly enriching STEM education and hands-on robotics skills.
Expertise: Robotics, AI, Mechanical Design, Electronics, Software Development.